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TITLE(s): DIE ATTACHING MACHINE TENDER (electron. comp.) Tends die attaching machine that bonds dies to semiconductor packages: Loads package carriers, magazines containing dies, and gold pieces, used to attach dies to packages, into designated slots of machine. Starts machine that automatically positions and melts gold on packages and positions dies in packages to form assembled semiconductor packages. Observes operation of machine to ensure that alignment of packages, gold, and dies meets company specifications, using video monitor. Turns knobs on machine to adjust alignment of parts assembled, regulate operation speed, and set temperature of molten gold. Removes magazines of packages for further processing. GOE: 06.04.09 STRENGTH: L GED: R2 M1 L2 SVP: 2 DLU: 86 | |||||||||||||||||||||||||||||||||||
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