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TITLE(s): WAFER ABRADING MACHINE TENDER (electron. comp.) Tends abrading machines that roughen surface of semiconductor wafers to distinguish front from back: Adjusts controls to set speed, time, and pressure of abrading belts according to specifications. Loads container of wafers into abrading machine and starts machine that automatically abrades surface of wafer. Removes abraded wafers from machine and inspects wafers to detect abrading defects, such as cracks, using microscope. Replaces worn abrading belts. GOE: 06.04.09 STRENGTH: L GED: R2 M1 L2 SVP: 2 DLU: 86 ONET CROSSWALK: 92965 Crushing, Grinding, Mixing, and Blending Machine Operators and Tenders |
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TITLE(s):
WAFER ABRADING MACHINE TENDER (electron. comp.)
Tends abrading machines that roughen surface of semiconductor wafers to distinguish front from
back: Adjusts controls to set speed, time, and pressure of abrading belts according to
specifications. Loads container of wafers into abrading machine and starts machine that
automatically abrades surface of wafer. Removes abraded wafers from machine and inspects wafers to
detect abrading defects, such as cracks, using microscope. Replaces worn abrading belts.
GOE: 06.04.09 STRENGTH: L GED: R2 M1 L2 SVP: 2 DLU: 86
ONET CROSSWALK: 92965 Crushing, Grinding, Mixing, and Blending Machine Operators and Tenders
© 1995 - 2015 Photius Coutsoukis and Information Technology Associates (All Rights Reserved). Revised 26-May-03