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TITLE(s): WAFER ABRADING MACHINE TENDER (electron. comp.) Tends abrading machines that roughen surface of semiconductor wafers to distinguish front from back: Adjusts controls to set speed, time, and pressure of abrading belts according to specifications. Loads container of wafers into abrading machine and starts machine that automatically abrades surface of wafer. Removes abraded wafers from machine and inspects wafers to detect abrading defects, such as cracks, using microscope. Replaces worn abrading belts. GOE: 06.04.09 STRENGTH: L GED: R2 M1 L2 SVP: 2 DLU: 86 ONET CROSSWALK: 92965 Crushing, Grinding, Mixing, and Blending Machine Operators and Tenders | |||||||||||||||||||||||||||||||||||
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