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CODE: 590.685-078Buy the DOT:Download
TITLE(s): ETCHER (electron. comp.) alternate titles: wafer etcher

Tends etching equipment that reduces thickness of semiconductor wafers: Transfers wafers from storage container to chemical-resistant boat. Monitors control panel of etching equipment to verify that etching solution temperatures meet processing specifications. Immerses boat of wafers into series of sinks containing etching solutions and water rinses and sets timers. Measures wafer thickness before and after etching, using thickness gauge, and calculates wafer thickness removed by etching. Tends machine that rinses and dries etched wafers. Records production details on work order. Replaces etching and rinsing solutions in equipment and cleans work area. May measure wafer flatness, using flatness gauge. May measure diameter of semiconductor crystals, using micrometer, and tend etching equipment that reduces crystal diameter. May calculate etching time based on thickness of material to be removed from wafers on crystals.
GOE: 06.04.19 STRENGTH: M GED: R2 M2 L2 SVP: 2 DLU: 86
ONET CROSSWALK: 92902B Electronic Semiconductor Wafer Etchers and Engravers

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CODE: 590.685-078 Buy the DOT:Download TITLE(s): ETCHER (electron. comp.) alternate titles: wafer etcher

Tends etching equipment that reduces thickness of semiconductor wafers: Transfers wafers from storage container to chemical-resistant boat. Monitors control panel of etching equipment to verify that etching solution temperatures meet processing specifications. Immerses boat of wafers into series of sinks containing etching solutions and water rinses and sets timers. Measures wafer thickness before and after etching, using thickness gauge, and calculates wafer thickness removed by etching. Tends machine that rinses and dries etched wafers. Records production details on work order. Replaces etching and rinsing solutions in equipment and cleans work area. May measure wafer flatness, using flatness gauge. May measure diameter of semiconductor crystals, using micrometer, and tend etching equipment that reduces crystal diameter. May calculate etching time based on thickness of material to be removed from wafers on crystals.
GOE: 06.04.19 STRENGTH: M GED: R2 M2 L2 SVP: 2 DLU: 86
ONET CROSSWALK: 92902B Electronic Semiconductor Wafer Etchers and Engravers


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