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CODE: 590.684-022Buy the DOT:Download
TITLE(s): SEMICONDUCTOR PROCESSOR (electron. comp.)

Performs any combination of following tasks to process materials used in manufacture of electronic semiconductors: Saws, breaks, cleans, and weighs semiconductor materials to prepare materials for crystal growing. Forms seed crystal for crystal growing, using x-ray equipment, drill, and sanding machine. Loads semiconductor material, seed crystal, and dopant into crystal growing furnace and monitors furnace to grow crystal ingot of specified characteristics. Grinds ingot to attain specified diameter and cylindricity, using grinding machine. Locates crystal axis of ingot, using x-ray equipment, and grinds flat on ingot. Saws ingot into wafers, using power saw. Etches, laps, polishes, and heat treats wafers to produce wafers of specified thickness and finish, using etching equipment, lapping and polishing machines, and furnace. Cleans materials, seed crystals, ingots, and wafers, using cleaning, etching, and sandblasting equipment. Inspects materials, ingots, and wafers for surface defects. Measures dimensions of ingots and wafers, using precision measuring instruments. Tests electrical characteristics of materials, ingots, and wafers, using electrical test equipment.
GOE: 06.04.32 STRENGTH: M GED: R2 M2 L2 SVP: 3 DLU: 86
ONET CROSSWALK: 92902A Electronic Semiconductor Processors

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CODE: 590.684-022 Buy the DOT:Download TITLE(s): SEMICONDUCTOR PROCESSOR (electron. comp.)

Performs any combination of following tasks to process materials used in manufacture of electronic semiconductors: Saws, breaks, cleans, and weighs semiconductor materials to prepare materials for crystal growing. Forms seed crystal for crystal growing, using x-ray equipment, drill, and sanding machine. Loads semiconductor material, seed crystal, and dopant into crystal growing furnace and monitors furnace to grow crystal ingot of specified characteristics. Grinds ingot to attain specified diameter and cylindricity, using grinding machine. Locates crystal axis of ingot, using x-ray equipment, and grinds flat on ingot. Saws ingot into wafers, using power saw. Etches, laps, polishes, and heat treats wafers to produce wafers of specified thickness and finish, using etching equipment, lapping and polishing machines, and furnace. Cleans materials, seed crystals, ingots, and wafers, using cleaning, etching, and sandblasting equipment. Inspects materials, ingots, and wafers for surface defects. Measures dimensions of ingots and wafers, using precision measuring instruments. Tests electrical characteristics of materials, ingots, and wafers, using electrical test equipment.
GOE: 06.04.32 STRENGTH: M GED: R2 M2 L2 SVP: 3 DLU: 86
ONET CROSSWALK: 92902A Electronic Semiconductor Processors


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